Input voltage reduction for processing devices

ABSTRACT

Voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method of determining operating voltages for a processing device includes executing a voltage adjustment process to determine at least one input voltage for the processing device lower than a manufacturer specified operating voltage. During the voltage adjustment process, the method includes applying incrementally adjusted input voltages to the processing device, operating the processing device according to a functional test that exercises the processing device in context with associated system elements of a computing assembly, and monitoring for operational failures of at least the processing device during application of each of the incrementally adjusted input voltages. Responsive to the operational failures, the method includes determining corresponding values of the incrementally adjusted input voltages and establishing an input voltage based at least in part on the corresponding values of the incrementally adjusted input voltages.

BACKGROUND

Integrated circuits, such as those employed in computing systems andassociated processor devices, typically consume electrical power inrelation to a supply voltage, operating frequency, performance level, oraccording to characteristics of various leakage and parasitic elements.Power consumption in computing devices, such as computers, laptops,tables, servers, smartphones, gaming machines, and the like, can have asubstantial power budget allocated to main processor, graphicsprocessor, or system-on-a-chip (SoC) elements. These processors caninclude more than one domain that segregates power consumption amongparticular portions of an integrated circuit device, such as toparticular processing or graphics cores each having corresponding supplyvoltage requirements.

OVERVIEW

Power reduction and voltage adjustment techniques for computing systemsand various devices are presented herein. In one example, a method ofdetermining operating voltages for a processing device includesexecuting a voltage adjustment process to determine at least one inputvoltage for the processing device lower than a manufacturer specifiedoperating voltage. During the voltage adjustment process, the methodincludes applying incrementally adjusted input voltages to theprocessing device, operating the processing device according to afunctional test that exercises the processing device in context withassociated system elements of a computing assembly, and monitoring foroperational failures of at least the processing device duringapplication of each of the incrementally adjusted input voltages.Responsive to the operational failures, the method includes determiningcorresponding values of the incrementally adjusted input voltages andestablishing an input voltage based at least in part on thecorresponding values of the incrementally adjusted input voltages.

This Overview is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. It may be understood that this Overview is not intended toidentify key features or essential features of the claimed subjectmatter, nor is it intended to be used to limit the scope of the claimedsubject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the disclosure can be better understood with referenceto the following drawings. While several implementations are describedin connection with these drawings, the disclosure is not limited to theimplementations disclosed herein. On the contrary, the intent is tocover all alternatives, modifications, and equivalents.

FIG. 1 illustrates a voltage adjustment environment in animplementation.

FIG. 2 illustrates a method of operating a voltage adjustmentenvironment in an implementation.

FIG. 3 includes graphs illustrating voltage and power reduction in animplementation.

FIG. 4 illustrates a voltage adjustment environment in animplementation.

FIG. 5 illustrates operation of a voltage adjustment environment in animplementation.

FIG. 6 illustrates operation of thermal voltage adjustment in animplementation.

FIG. 7 illustrates an example computing system suitable for implementingany of the architectures, platforms, processes, methods, and operationalscenarios disclosed herein.

FIG. 8 illustrates a method of operating a secure voltage process in animplementation.

DETAILED DESCRIPTION

Power consumption in computing devices, such as computers, laptops,tables, servers, smartphones, gaming machines, and the like, can have asubstantial power budget allocated to main processor or system-on-a-chip(SoC) elements. As processing demands increase in computing devices,associated power consumption has risen proportionally, leading todifficulties in device packaging, battery life, heat dissipation, fannoise, and speed limitations for associated computing devices. Whenintegrated circuit devices, such as processors or processing devices,are manufactured, substantial voltage margins are included to accountfor part-to-part variation, system integration margins, and end-of-life(EoL) margins, among other margins. These margins allow for uniformityand ease of manufacturing testing, but have higher voltages and powerconsumptions. Operating at higher voltages and power consumptions inintegrated circuits and associated equipment can lead to increasedcomponent stresses and lower component long-term reliability. Processingdevices can also be manufactured using microfabrication processes whichshrink feature geometries and produce associated decreases in devicecapacitance and decreases in operational voltage requirements, which canlead to reductions in power consumption. However, device leakage canbecome more of a problem with these smaller geometries.

These processing devices can also include more than one power domainthat segregates power consumption among particular portions, such as toparticular processing cores or graphics cores each having correspondingsupply voltage requirements. Throttling of processing devices, such asby reducing/slowing an operating frequency or powering-down selectivepower domains, can be employed to reduce power consumption and reduceassociated temperatures for the computing devices. Some examples ofthrottling or selective power down include restricting only AC power bydisabling a clock or particular logic function while leaving DC powerconsumption unaffected. DC power consumption can be reduced by poweringdown portions of a processing device or the entire processing device.However, capabilities and performance of the processing devices aretypically abridged during these throttling operations. Other powersaving techniques are related to providing system-level voltageregulators and power supplies with improved operational efficiencies.

The various examples and implementations described herein advantageouslyprovide for lower power consumption in processing devices and associatedcomputing systems without altering performance levels of the processingdevices and associated computing systems. Voltage reduction techniquesare discussed for computing systems and processing devices to determinereduced operating voltages below manufacturer-specified voltages. Thesereduced operating voltages can lead to associated reductions in powerconsumption. Also, techniques and implementations illustrate variousways to employ these reduced operating voltages once determined, such asin systems with security features to restrict alteration of operatingvoltages or to assist in thermal management.

The voltage adjustment techniques herein exercise a processing device,such as a system-on-a-chip (SoC) device, in the context of varioussystem components of a computing assembly. These system components caninclude one or more enclosures, thermal management elements (such ascooling fans, heatsinks, or heat pipes), memory elements (such as randomaccess memory or cache memory), data storage elements (such as massstorage devices), and power electronics elements (such as voltageregulation or electrical conversion circuitry), among others, exercisedduring functional testing of the processing device. Moreover, thevoltage adjustment techniques herein operationally exercise internalcomponents or portions of a processing devices, such as processing coreelements, graphics core elements, north bridge elements, input/outputelements, or other integrated features of the processing device.

During manufacture of processing devices, a manufacturing test canadjust various voltage settings for a manufacturer-specified operatingvoltage for the various associated voltage domains or voltage rails ofthe processing device. When placed into a computing apparatus, such as acomputer, server, gaming system, or other computing device, voltageregulation elements use these manufacturer-specified operating voltagesto provide appropriate input voltages to the processing device. Voltagetables can be employed that relate portions of the processing device tomanufacturer-specified operating voltages as well as to specific clockfrequencies for those portions. Thus, a hard-coded frequency/voltage(F/V) table is employed in many processing devices which might be setvia fused elements to indicate to support circuitry preferred voltagesfor different voltage domains and operating frequencies. In someexamples, these fused elements comprise voltage identifiers (VIDs) whichindicate a normalized representation of the manufacturer-specifiedoperating voltages.

Built-in system test (BIST) circuitry can be employed to test portionsof a processing device, but this BIST circuitry typically only activatesa small portion of a processing device and only via dedicated andpredetermined test pathways. Although BIST circuitry can test forcorrectness/validation of the manufacture a processing device, BISTcircuitry often fails to capture manufacturing variation between devicesthat still meets BIST thresholds. Manufacturing variations from deviceto device include variations in metal width, metal thickness, insulatingmaterial thickness between metal layers, contact and via resistance, orvariations in transistor electrical characteristics across multipletransistor types, and all variations can have impacts on the actualresults of power consumption in functional operation. Not only do thesestructures vary from processing device to processing device, but theyvary within a processing device based on normal process variation andphotolithography differences that account for even subtle attributedifferences in all these structures. As a result, the reduced operatingvoltages can vary and indeed may be unique on each processing device.BIST also typically produces a pass/fail result at a specific testcondition. This test condition is often substantially different fromreal system operation for performance (and power) such that it does notaccurately represent system power and performance capability of thedevice. With large amounts of variability between a BIST result and afunctional result, the voltages employed by BIST may be found sufficientfor operation but might employ significant amounts of voltage margin. Incontrast to BIST testing, the functional tests described herein employfunctional patterns that activate not only the entire processing devicebut also other components of the contextually-surrounding system thatmay share power domains or other elements with the processing device.

In the examples herein, functional tests are employed to determinereduced operating voltages (Vmins) for a processing device, such as asystem-on-a-chip (SoC) devices, graphics processing units (GPUs), orcentral processing units (CPUs). These functional tests run system-levelprograms which test not only a processing device, but the entirecomputing system in which the processing device is installed. Targetedapplications can be employed which exercise the computing system and theprocessing device to ensure that particular processing units within theprocessing device are properly activated. This can include ensuring thatall portions of the processing device are activated fully, a subset ofunits activated fully, or specific sets of background operations activein combination with targeted power-consuming operations.

In a specific example, an SoC is employed in a computing system. The SoCcan comprise a central processing unit (CPU) with one or more processingcores, a graphics processing unit (GPU) with one or more graphics cores,a north bridge which handles communication between various cores,integrated memory, and off-SoC memory. Input/output portions are alsoincluded in the SoC to allow for communication with universal serial bus(USB) ports, peripheral component interconnect express (PCIe) links,mass storage interfaces, networking interfaces such as Ethernet orwireless networking, user interface devices, game controllers, and otherdevices communicatively coupled to the SoC. Multiple power domains canbe employed in the SoC, such as a first one for the processing cores, asecond one for the north bridge, and a third one for the graphics cores,among others. Each of these cores can be functionally tested in parallelto ensure traffic propagation and logical activation across coreboundaries comprising both clock and voltage boundaries.

The functional tests for CPU portions can include operations initiatedsimultaneously on all the processing cores (or a sufficient number ofthem to represent a ‘worst’ possible case that a user application mightexperience) to produce both DC power demand and AC power demand for theprocessing cores that replicates real-world operations. Distributedchecks can be provided, such as watchdog timers or error checking andreporting elements built into the processing device, and are monitoredor report alerts if a failure, crash, or system hang occurs. A similarapproach can be used for the GPU, where the functional test ensures theGPU and associated graphics cores focus on high levels of graphicrendering activity to produce worst case power consumption (DC and AC),temperature rises, on-chip noise, and a sufficient number of real datapaths which produce accurate operational Vmins. North bridge testing canproceed similarly, and also include memory activity between off-devicememory devices and on-chip portions that are serviced by those memorydevices.

The power reduction using voltage adjustment processes herein can employvoltage regulation modules (VRMs) or associated power controllercircuitry with selectable voltage supply values (such as in incrementsof 12.5 mV, 6.25 mV, 3.125 mV, and the like), where the processingdevice communicates with the VRMs or associated power controllercircuitry to indicate the desired voltage supply values during anassociated power/functional test or state in which the processing devicemay be operating.

Once reduced voltage values have been determined, the processing devicecan receive input voltages set to a desired reduced value fromassociated VRMs. This allows input voltages for processing devices to beset below manufacturer specified levels, leading to several technicaleffects. For example, associated power savings can be significant, suchas 20-50 watts in some examples or 30% in other cases, and cost savingscan be realized in the design and manufacturing of reduced capacitysystem power supplies, reductions in the VRM specifications for theprocessing devices, cheaper or smaller heat sinks and cooling fans.Smaller system enclosures or packaging can be employed. Additionally,the power savings can result in system characteristics that reduceelectrical supply demands or battery drain.

Turning now to the various examples shown in the included drawings, FIG.1 is presented which illustrates a voltage adjustment environment in animplementation. Specifically, FIG. 1 includes voltage adjustmentenvironment 100. Environment 100 includes deployment platform 101 anduser system coupled over one or more communication links, such ascommunication link 152. Further example systems and elements which canimplement the features discussed for user system 110 are included in atleast FIG. 4 and FIG. 7 below.

User system 110 includes several components detailed in FIG. 1. Thesecomponents include system processor 120 and power system 130. Systemprocessor 120 can comprise one or more integrated elements, such asprocessor cores 121, cache memory 122, communication interfaces 123,graphics cores 124, and north bridge 125, among other integratedelements not shown for clarity. Furthermore, user system 110 can includeassembly elements, namely enclosure elements 111, thermal managementelements 112, memory elements 113, storage elements 114, communicationinterfaces 115, and graphics elements 116, among other elements notshown for clarity. When system processor 120 is installed in user system110, these assembly elements provide system resources and context forthe operation of system processor 120.

In operation, power system 130 provides one or more input voltages tosystem processor 120 over links 151. System processor 120 can requestthe one or more input voltages or change levels of the one or more inputvoltages over link 150. System processor 120 can then boot into anoperating system (OS) once provided with input voltages to providevarious operations of user system 110 including user applications,communication services, storage services, gaming services, or otherfeatures of a computing system. To establish the one or more inputvoltage levels, deployment platform 101 can transfer software 140 orrelated instructions to user system 110 over link 152, which performs avoltage adjustment process to determine reduced operating voltages foruser system 110 or system processor 120.

FIG. 2 is included to illustrate operation of the voltage adjustmentprocess. Specifically, FIG. 2 is a flow diagram illustrating a method ofoperating elements of environment 100 in an implementation. The voltageadjustment method discussed in FIG. 2 allows system processor 120 orassociated user system 110, in concert with deployment system 101, todetermine appropriate reduced input voltages for system processor 120,resulting in power savings for user system 110.

A processor device, such as system processor 120, is initiallyincorporated (211) into a manufactured system, namely user system 110.In FIG. 1, system processor 120 is shown installed into user system 110,such as on a motherboard or other circuit board of user system 110. Usersystem 110 also includes many contextual assembly elements, as mentionedabove. In many examples, user system 110 is a system into which systemprocessor 120 is installed during a system assembly process beforetesting and shipment to a user. Thus, the hardware and software elementsincluded in user system 110 might be the actual elements with whichsystem processor 120 operates once installed at a user site.

User system 110 initially employs (212) default voltages to providepower to system processor 120. For example, power system 130 can provideinput voltages over links 151 according to manufacturer-specifiedoperating voltages, which can be indicated by VID information receivedfrom system processor 120 over link 150. In other examples, such as whenprogressively rising voltages are iteratively provided to systemprocessor 120, the default voltages can comprise a starting point fromwhich to begin raising voltage levels over time. In examples that employincrementally rising voltages, starting voltages might be selected to besufficiently low enough and less than those supplied by a manufacturer.Other default voltage levels can be employed. Once the input voltagesare provided, system processor 120 can initialize and boot into anoperating system or other functional state.

Deployment platform 101 might transfer one or more functional tests overlink 152 for execution by system processor 120 after booting into anoperating system. Deployment platform 101 can transfer software,firmware, or instructions over link 152 to user system 110 to initiateone or more functional tests of user system 110 during a voltageadjustment process. These functional tests can comprise performancetests that exercise the various integrated elements of system processor120 as well as the various contextual assembly elements of user system110. Portions of the voltage adjustment process or functional tests canbe present before boot up to adjust input voltages for system processor120, such as by first initializing a first portion of system processor120 before initializing second portions. Further discussions of theseportions are found below in FIGS. 7-8.

Once system processor 120 can begin executing the functional test,system processor 120 runs one or more performance tests on each of thepower domains (213) of system processor 120. These power domains caninclude different input voltages and different input voltage levels. Thefunctional tests can exercise two or more of the power domainssimultaneously, which might further include different associated clocksignals to run associated logic at predetermined frequencies. Asmentioned above, the functional tests can include operations initiatedsimultaneously on more than one processing core to produce both DC powerdemand and AC power demand for the processing cores, graphics cores, andinterfacing cores that replicates real-world operations. Moreover, thefunctional tests include processes that exercise elements of user system110 in concert with elements of system processor 120, such as storagedevices, memory, communication interfaces, thermal management elements,or other elements.

System processor 120 will typically linger at a specific operatingvoltage or set of operating voltages for a predetermined period of time.This predetermined period of time allows for sufficient execution timefor the functional tests to not only exercise all desired system andprocessor elements but also to allow any errors or failures to occur.The linger time can vary and be determined from the functional teststhemselves, or set to a predetermined time based onmanufacturing/testing preferences. Moreover, the linger time can beestablished based on past functional testing and be set to a value whichpast testing indicates will capture a certain population oferrors/failures of system processors in a reasonable time.

If system processor 120 and user system 110 do not experience failuresor errors relevant to the voltage adjustment process during the lingertime, then the specific input voltages employed can be considered to besufficiently high to operate user system 110 successfully (214). Thus,the particular iteration of input voltage levels applied to systemprocessor 120 is considered a ‘pass’ and another progressively adjustedinput voltage can be applied. As seen in operation (216) of FIG. 2,input voltages for system processor 120 can be incrementally lowered,system processor 120 restarted, and the functional tests executed againfor the linger time. A restart of processor 120 might be omitted in someexamples, and further operational testing can be applied at a newvoltage level for each linger timeframe in a continuous or repeatingmanner. This process is repeated until either lower limits of voltageregulators associated with power system 130 have been reached (215), orrelevant failures of system processor 120 or user system 110 areexperienced. This process is employed to determine reduced operatingvoltages for system processor 120 in the context of the assemblyelements of user system 110. Once voltage adjustments for the associatedpower domains are found, indications of these voltage adjustments can bestored for later use at voltage ‘minimums’ (Vmins) in operation 217,optionally with margins appropriate for operational ‘safety’ to reduceundiscovered failures or errors during the functional testing.

The functional tests can comprise one or more applications, scripts, orother operational test processes that bring specific power domains up todesired power consumption and operation, which may be coupled withensuring that user system 110 is operating at preferred temperature aswell. These functional tests may also run integrity checks (such aschecking mathematical computations or checksums which are deterministicand repeatable). Voltages provided by power system 130 can be loweredone incremental step at a time and the functional tests run for a periodof time until a failure occurs. The functional tests can automaticallyhandle all possible failure modes resulting from lowering the voltagebeyond functional levels. The possible failures include checksum errorsdetected at the test application level, a kernel mode crash detected bythe operating system, a system hang, or hardware errors detected bysystem processor resulting in “sync flood” error mechanisms, amongothers. All failure modes can be automatically recovered from forfurther functional testing. To enable automatic recovery, a watchdogtimer can be included and started in a companion controller, such as a“System Management Controller” (SMC), Embedded Controller, or othercontrol circuitry. The functional tests can issue commands to thecompanion controller to initialize or reset the watchdog timerperiodically. If the watchdog timer expires or system processor 120experiences a failure mode, the companion controller can perform asystem reset for user system 110 or system processor 120. Failure modesthat result in a system reset can prompt associated circuitry orcompanion controllers to initialize system processor 120 with ‘default’or ‘known good’ voltage levels from power system 130. These defaultlevels can include manufacturer specified voltages or include voltagelevels associated with a most recent functional test ‘pass’ condition.

Once user system 110 initializes or boots after a failure during thefunctional tests, the failure can be noted by a failure process in thefunctional tests or by another entity monitoring the functional tests,such as deployment platform 101. The voltage level can then be increaseda predetermined amount, which might comprise one or more incrementsemployed during the previous voltage lowering process. The increase cancorrespond to 2-3 increments in some examples, which might account fortest variability and time-to-fail variability in the functional tests.

The voltage values determined from the voltage adjustment process can bestored into a memory device or data structure along with othercorresponding information, such as time/date of the functional tests,version information for the functional tests, or other information. Theversion identifier can be used to enable “in field” special handling ofresults determined by different revisions of user system 110. This datastructure can be securely signed by a hardware security module (HSM) toensure that the stored voltage information and related information isauthentic. A digital signature for the data structure can be validatedduring each subsequent boot of user system 110, and the stored voltageinformation can be used as the selected operational voltage for theremainder of any factory/manufacturing tests and subsequent user siteoperation. Further examples of secure voltage handling are discussed inFIG. 8.

The resulting user system characteristics (e.g. power levels, batteryoperation, system attributes) are substantially improved after thevoltage adjustment process is completed. Thus, the voltage adjustmentprocess described above allows user systems to individually ‘learn’appropriate reduced operating voltages during a manufacturing orintegration testing process. Examples of in situ voltage adjustmentprocesses are described below in FIG. 4.

The iterative voltage search procedure can be repeated independently foreach power domain and for each power state in each domain where powersavings are to be realized. For example, a first set of functional testscan be run while iteratively lowering an input voltage corresponding toa first voltage/power domain of system processor 120. A second set offunctional tests can then be run while iteratively lowering a secondinput voltage corresponding to a second voltage/power domain of systemprocessor 120. When the second set of functional tests are performed forthe second input voltage, the first voltage can be set to a value foundduring the first functional tests or to a default value, among others.

Advantageously, end-of-line (EoL) voltage margin need not be addedduring manufacturing test or upon initial shipment of user system 110.EoL margin can be added if desired, such as 10 to 50 millivolts (mV),among other values, or can be added after later in-situ testingdescribed below. EoL margins are typically added in integrated circuitsystems to provide sufficient guardband as associated silicon timingpaths in the integrated circuit slow down over time with use. Althoughthe amount of margin typically employed for EoL is only perhaps 15-30 mV(depending upon operating conditions, technology attributes, and desiredlife time), the systems described herein can eliminate this margininitially, either partially or entirely. In some examples, an initialvoltage margin is employed incrementally above the Vmin at an initialtime, and later, as the system operates during normal usage, further EoLmargin can be incrementally added proportional to the total operationaltime (such as in hours) of a system or according to operational time forindividual voltage domains. Thus, extra voltage margin is recovered fromsystem processor 120 after the initial voltage adjustment process, andany necessary margin for EoL can be staged back over the operationallifetime of user system 110. Moreover, by operating a user system atlower voltages for a longer period of time, system reliability isfurther improved and system acoustic levels are also more desirable,since lower power levels mean lower average fan speeds will be requiredto cool the system. These acoustic benefits might taper off over thecourse of time as the EoL margin is staged back in, but it will improvethe initial customer experience.

In further examples, the process described above can be conducted in anexemplary or model user system, with system processor 120 included in asocket or socketed configuration. This alternate method can be usedinstead of the previous one listed or in addition to it. In thisexample, the reduced voltages are determined during the devicemanufacturing process through the use of a socketed system that isutilized for system processor testing. In this example, the voltageadjustment process occurs in a socketed system before system processor120 is assembled in a manufacturing process into a final user system110, such as with other system components in a final assembly. Althoughsome voltage adjustment can occur in the socketed system, a normalizedor modeled additional or lesser margins can be removed/added from thefinal results of the socketed test to account for variation in the finalassembly hardware/software. The final voltage levels found might bestored either in non-volatile memory of system processor 120, or inanother system which later transfers the final voltage levels into afinal assembly. Another, abbreviated, final integration voltageadjustment test can occur to validate the socketed testing results.Alternatively, the socketed testing can establish a default or baselinevoltage from which the fully-integrated system can use during anothervoltage adjustment process.

FIG. 3 illustrates various graphs that show how a voltage adjustmentprocess might progress, namely graph 300 and graph 320. Graph 300 showsa ‘downward’ incremental Vmin search using progressively loweredvoltages, with safety margin added at the end of the process toestablish an operational voltage, V_(OP). Later margin (V_(EOL)) can bestaged in to account for EoL concerns. Specifically, graph 300 shows adefault or initial voltage level V_(O) applied to a processor device.After a linger time for a functional test, a successful outcome promptsan incremental lowering to V₁ and retesting under the functional test.Further incremental lowering can be performed for each successfuliteration of the functional test for an associated time indicated ingraph 300. Finally, a lowest or reduced operating voltage is found at V₃and optional margin is applied to establish V_(OP). V_(OP) is employedfor the normal operation of the processing device for a period ofoperational time indicated by t₅. This time can occur while anassociated system is deployed on-site. After a designated number ofhours indicated by t₅, EoL margin can be staged in to establishedV_(EOL). Multiple stages of EoL margin can occur, although only one isshown in graph 300 for clarity.

In contrast to the downward voltage search in graph 300, graph 320illustrates an upward voltage search process. Graph 320 shows anincreasing incremental Vmin search using progressively raised voltagesto establish an operational voltage, V_(OP). Later margin (V_(EOL)) canbe staged in to account for EoL concerns. Specifically, graph 320 showsa manufacturer specified voltage level at V₀, and an initial testvoltage level V₁ applied to a processor device. After a linger time fora functional test at V₁, a failed test outcome prompts an incrementalraising to V₂ and retesting under the functional test. Furtherincremental raising can be performed for each unsuccessful testiteration of the functional test for an associated time indicated ingraph 300. Finally, a successful operating voltage is found at V₃ wherethe functional tests indicate a ‘pass’ condition. Since the incrementsmight be of a large granularity, the operational voltage might beestablished by a brief test at a slightly lower voltage to establishV_(OP), or V_(OP) can be set to V₃ in other examples. V_(OP) is employedfor the normal operation of the processing device for a period ofoperational time indicated by t₄. This time can occur while anassociated system is deployed on-site. After a designated number ofhours indicated by t₄, EoL margin can be staged in to establishedV_(EOL). Multiple stages of EoL margin can occur, although only one isshown in graph 320 for clarity.

The voltage levels indicated in FIG. 3 can vary and depend upon theactual voltage levels applied to a processing device. For example, for adevice operating around 0.9V, a reduced voltage level can be discoveredusing the processes in graphs 300 or 320. Safety margin of 50 mV mightbe added in graph 300 to establish V_(OP) and account for variation inuser applications and device aging that will occur over time. However,depending upon the operating voltage, incremental step size, and agingconsiderations, other values could be chosen.

The processes in graphs 300 and 320 can be executed independently foreach power supply or power domain associated with a processing device.Running the procedure on one power supply or power domain at a time canallow for discrimination of which power supply or power domain isresponsible for a system failure when looking for the Vmin of eachdomain. However, lowering multiple voltages for power supplies or powerdomains at the same time can be useful for reducing test times,especially when failure can be distinguished among the various powersupplies or power domains. In further examples, a ‘binary’ voltageadjustment/search algorithm can be used to find the Vmin by reducing thevoltage half way to an anticipated Vmin as opposed to stepping in theincrements of graphs 300 or 320. In such examples, a Vmin furthertesting might be needed by raising the voltage once a failure occurredand successfully running system tests at that raised value. Othervoltage adjustment/search techniques could be used and the techniqueswould not deviate from the operations to establish a true Vmin inmanufacturing processes that can then be appropriately adjusted toprovide a reasonable margin for end user operation.

Also included in FIG. 3 is graph 330. Graph 330 illustrates potentialpower savings for a population of processing devices. As a Vmin isestablished for each processing device, the population of powerconsumptions for the processing devices indicated by the ‘Gaussian’distribution will shift to the left, indicating a lower overall powerconsumption for the devices. It should be noted that in examples without‘normal’ distributions of devices, a shift in the population of powerconsumption can also occur for those distributions.

Returning to the elements of FIG. 1, deployment platform 101 comprises aplatform from which voltage adjustment process 140 is staged, andfailures or successes of the functional test are monitored. Deploymentplatform 101 can include communication interfaces, network interfaces,processing systems, computer systems, microprocessors, storage systems,storage media, or some other processing devices or software systems, andcan be distributed among multiple devices or across multiple geographiclocations. Examples of deployment platform 101 can include software suchas an operating system, logs, databases, utilities, drivers, networkingsoftware, and other software stored on a computer-readable medium.Deployment platform 101 can comprise one or more platforms which arehosted by a distributed computing system or cloud-computing service.Deployment platform 101 can comprise logical interface elements, such assoftware defined interfaces and Application Programming Interfaces(APIs).

User system 110 and deployment platform 101 can communicate over one ormore communication link 152. In some examples, communication link 152comprise one or more network links, such as wireless or wired networklinks. Other configurations are possible with elements of user system110 and deployment platform 101 communicatively coupled over variouslogical, physical, or application programming interfaces. Examplecommunication links can use metal, glass, optical, air, space, or someother material as the transport media. Example communication links canuse various communication interfaces and protocols, such as InternetProtocol (IP), Ethernet, USB, Thunderbolt, Bluetooth, IEEE 802.11 WiFi,or other communication signaling or communication formats, includingcombinations, improvements, or variations thereof. Communication linkscan be direct links or may include intermediate networks, systems, ordevices, and can include a logical network link transported overmultiple physical links.

User system 110 comprises a computing system or computing assembly, suchas a computer, server, tablet device, laptop computer, smartphone,gaming system, entertainment system, storage system, or other computingsystem, including combinations thereof. User system 110 includes severalcomponents detailed in FIG. 1. These components include system processor120 and power system 130. Furthermore, user system 110 can includeassembly elements, namely enclosure elements 111, thermal managementelements 112, memory elements 113, storage elements 114, communicationinterfaces 115, and graphics elements 116, among other elements notshown for clarity. Enclosure elements 111 can include structural supportelements, cases, chassis elements, or other elements that house andstructurally support the further elements of user system 110. Thermalmanagement elements 112 can include heatsinks, fans, heat pipes, heatpumps, refrigeration elements, or other elements to manage and controltemperature of user system 110. Memory elements 113 can compriserandom-access memory (RAM), cache memory devices, or other volatilememory elements employed by system processor 120. Storage elements 114comprise non-volatile memory elements, such as hard disk drives (HDDs),flash memory devices, solid state drives (SSDs), or other memory deviceswhich store operating systems, applications, or other software orfirmware for user system 120. Communication interfaces 115 can includenetwork interfaces, peripheral interfaces, storage interfaces,audio/video interfaces, or others which communicatively couple usersystem to external systems and devices. Graphics elements 116 caninclude display interfaces, displays, touchscreens, touch interfaces,user interfaces, among others.

Power system 130 typically includes voltage regulator circuitry,controller circuitry, power filtering elements, power conditioningelements, power conversion elements, power electronics elements, orother power handling and regulation elements. Power system 130 receivespower from an external source, such as from batteries or an externalpower source, and converts/regulates the power to produce voltages andcurrents to operate the elements of user system 110.

As a further example of voltage adjustment processes, FIG. 4 ispresented. FIG. 4 discusses on-site or in-situ voltage adjustment of auser system. Although the discussion below for FIG. 4 is in the contextof a deployment platform and user system that are located at sitesremote from each other, it should be understood that features discussedabove for the manufacturing testing-based voltage adjustment can applyin FIG. 4, and vice versa.

FIG. 4 illustrates voltage adjustment environment 400 in animplementation. Environment 400 includes deployment platform 402, one ormore packet networks 405, gaming system 410. In this example, a usersystem comprises a gaming system, although any user system mentionedherein might instead be employed. Moreover, gaming system 410 includesuser interface devices, such as gaming controller 411, along with one ormore processing devices 412. Other elements of a user system, such as apower control system, are included but omitted in FIG. 4 to focus onvoltage characterization platform elements. Further example systems andelements which can implement the features discussed for gaming system410 are included in at least FIG. 1 above and FIG. 7 below.

Deployment platform 402 located at site ‘A’ which is remote from site‘B’ of gaming system 410. Deployment platform 402 and gaming system 410communicate over one or more packet networks 405 and associated links.For example, site ‘A’ can be a vendor site or distributed computingplatform and site ‘B’ can be a customer or user location, such as abusiness, residence, or other location. Initially, gaming system 410might not have been adjusted for operating with voltages lower thanmanufacturer specified voltages for processing device 412 when installedin gaming system 410. Deployment platform 402 can transfer voltageadjustment firmware 430 for delivery to gaming system 410. Gaming system410 can then execute elements of voltage adjustment firmware 430 todetermine adjusted operating voltages for processing device 412 ofgaming system 410.

FIG. 5 is included to show example operations of elements of system 400.In FIG. 5, deployment platform 402 transfers voltage adjustment firmware430 for delivery to gaming system 410 over packet networks 405. Gamingsystem 410 receives voltage adjustment firmware 430 and executes voltageadjustment firmware 430 to provide voltage adjustment features to gamingsystem 410, such as provided by initial characterization platform 440and periodic adjustment platform 450. For example, initialcharacterization platform 440 can be executed to perform a voltagesearch for processing device 412. Resultant voltage data, such asvoltage levels found from the voltage search, can be transferred tostorage elements of gaming system 410 or to deployment platform 402.Further voltage adjustment processes can be handled by periodicadjustment platform 450, which can provide performance-based voltageadjustments and EoL voltage adjustments to processing device 412, ordetermine telemetry data derived from monitoring performance data oroperational statistics of gaming system. This telemetry data can betransferred for delivery to gaming system 410 for storage or todeployment platform 402 for comparison with other gaming systems, dataanalysis, archival, or other processing.

As mentioned above, voltage adjustment firmware 430 can comprise aninitial characterization platform 440 and periodic adjustment platform450. Elements of platforms 440 and 450 can be operated in parallel toachieve the various functions discussed herein. Voltage adjustmentfirmware 430 may be implemented in program instructions and among otherfunctions may, based at least in part on execution by gaming system 410,gaming system 410 to operate as described with respect to the variousoperational scenarios, sequences, and processes illustrated herein. Forexample, voltage adjustment firmware 430 may include programinstructions comprising initial characterization platform 440 thatestablishes reduced operating voltages for processor device 412, amongother functions. Voltage adjustment firmware 430 may include programinstructions comprising periodic adjustment platform 450 thatestablishes adjustments to the reduced operating voltages for EoLmargins, and also allows for voltage adjustment in various scenarios,among other functions.

Turning now to the specific modules of initial characterization platform440, the modules include performance simulator 441, performance monitor442, voltage control 443, and margin control 444. Performance simulator441 comprises one or more functional tests that exercise elements ofprocessing device 412, such as processing cores, graphics cores,communication elements, memory elements, among other elements.Performance simulator 441 also exercises processing device 412 incontext with elements of gaming system 410, such as storage drives, RAM,graphics cards, communication interfaces, fans, enclosures, heatmanagement elements, power supply elements, and the like. As discussedabove for the functional tests in FIGS. 1-2, these functional testsallow a rigorous operational test of gaming system 410 duringincremental adjustments to supply voltages for processing device 412.Voltage control module 443 allows for control of adjustments to supplyvoltages provided by a power system of gaming system 410 to processingdevice 412. During the operational testing provided by performancesimulator 441, performance monitor 442 provides for monitoring forfailures, crashes, overloads, or other conditions which might indicatethat a voltage supplied to processing device 412 is currently at too lowof a level for proper operation. Margin control module 444 can determinemargin to add after reduced voltages have been found for processingdevice 412 in gaming system 410. The margin can vary based on lifetimeof gaming system 410 (in examples where gaming system 410 already has anumber of operational hours), components and elements included in gamingsystem 410, projected usage patterns, past usage patterns, or otherfactors, including combinations thereof. The margin added to eachreduced voltage can vary based on the voltage domain, on the failuresnoted in the operational testing, or can be predetermined values, amongother values.

Initial characterization platform 440 can be executed during a bootperiod of gaming system 410, at a time when gaming system 410 is beingupgraded to a new version of operating system or gaming platformsoftware, or at another scheduled time when gaming system 410 can devotetime to non-user functions. Performance simulator 441 is loaded ontogaming system to stress associated power demand and input voltages forprocessing device 412, and the input voltages are lowered until one ormore failures occur. The voltages at which the system fails (or lastknown voltage at which the system ran successfully) are noted and usedto establish new reduced operating voltages for processing device 412.Margin, such as 10-20 mV from these reduced operating voltages can beadded for operational safety, and approximately 50 mV of margin forapplication-to-application guardband and EoL degradation. If a smallamount of guardband is desired for potential temperature effects (suchas 10-20 mV), that additional guardband could be added as well. All ofthe specific voltage values noted herein are for illustrative purposesand can be adjusted as needed due to actual voltage levels andappropriate amounts of guardband that vary with technology and overtime. Once a reduced value is found and appropriate margin included,final operational voltage(s) can be stored in non-volatile storagedevices and used for subsequent system operation.

Turning now to the specific modules of platform 450, the modules includeoperational telemetry module 451, EoL scaling module 452, thermalvoltage adjustment module 453, standby voltage adjustment module 454,frequency maximization module 455, failsafe module 456, and user inputmodule 457.

Telemetry module 451 monitors and stores operational statistics, voltagesettings, power consumptions, operational hours, workload statistics, orother information for gaming system 410. Telemetry data can helpdetermine the relative stability of system operation for each voltagesetting by at least tracking what system and voltage adjustment featuresare being used and what happens to an associated crash rate as a result.Telemetry also indicates if the lower voltage settings actually reducethe system crash rate due to the improved reliability characteristicsassociated with the lower voltages and temperatures. Telemetry data canbe stored in gaming system 410, such as in logs or databases held innon-volatile memory devices, and can be transferred for delivery todeployment platform for further analysis and storage. EoL scaling module452 can track operational hours or operational stress rates ofprocessing device 412, such as in conjunction with telemetry data, andestablish EoL voltage margins to compensate for EoL degradations overtime. A table of voltage margins related to operational hours or otherfactors can be maintained by gaming system 410 for usage in applying EoLmargin.

Thermal voltage adjustment module 453 can operate processing device 412with input voltages at a level above the reduced levels determinedpreviously and scale the voltages downward in response to temperaturelevels or power consumption levels of gaming system 410. For example, inaddition to the guardband or EoL margins discussed herein, a thermalvoltage adjustment margin can be applied. This thermal voltageadjustment margin might operate gaming system 410 at a higher than‘minimum’ or non-reduced power consumption, but as temperatures increasein an enclosure of gaming system this additional thermal voltageadjustment margin might be reduced to provide lower power operation—andthus lower corresponding temperatures. For example, gaming system 410might be operated at a manufacturer-specified voltage level untilthermal levels indicate adjustment is desired, and a reduced operatingvoltage can be applied according to a Vmin level determined previously.A further discussion of thermal voltage adjustment is found in FIG. 6below.

Standby voltage adjustment module 454 can also reduce voltages appliedto processing device 412 in response to portions of processing device412 or gaming system 410 entering into an idle or inactive state. Inmany cases, a reduced voltage level is established which preventscrashes or other failures of gaming system 410 during normal operation.However, when portions of gaming system are in a standby mode, reducedvoltage margins or other reduced voltage levels can also be applied forthese modes. For example, the initial characterization can alsodetermine reduced voltages or reduced margins for idle states or othermodes of processing device 412. Each voltage domain can be monitoredindividually for operational status and voltage levels adjustedaccordingly.

Frequency maximization module 455 provides for enhanced performance ofgaming system 410 in examples where greater than normal clockfrequencies are desired. The greater clock frequencies can providefaster operation of associated logic, memory, and communication elementsof processing device 412. However, added power consumption usuallyaccompanies increased clock frequencies. Similar to the thermaladjustment margin discussed above, an additional margin can be appliedto allow for frequency scaling beyond a guardband or EoL margin.Increases in performance by increasing clock frequency also causeincreases in power consumed at a fixed voltage. However, voltage can belowered while increasing frequency at the same time if gaming system 410desires to keep a power consumption constant or within predeterminedlimits. A process to determine Vmins can still use original systemfrequencies. However, a relationship between voltage and frequency(approximately 1% in voltage for every 1.5% in frequency) and the natureof how both voltage and frequency affect power consumption (leakage andAC power together follow approximately a “voltage cubed times frequency”formula) can allow the voltage margin to be turned into extraperformance at a constant power target. In this situation, if computingsystems can tolerate different performance values, each system can beadjusted independently for these different performance values, similarto adjustments for voltage levels.

Failsafe module 456 provides for failsafe mechanisms or control ofwatchdog elements that are employed to ensure that when gaming system410 is operating below manufacturer specified voltages, the voltages canbe subsequently increased in the event system operation becomes erratic,unstable, or experiences failures. Specifically, in user systems where avoltage has been set below a device manufacturer specified value on oneor more power supply rails, the voltage can be recovered to a highervalue if system stability (i.e. a number of system crashes or hangs)exceeds a predetermined value or some predetermined threshold. Thisfailsafe fallback methodology allows the system to increase the voltageby a small value, an intermediate value, or recover to the manufacturerspecified voltage in an attempt to restore stable system operationbefore noting the user system as a field failure. After a field failureand subsequent fallback, the user system can continue to operate at thefallback voltage levels, or might instead be prompted for return to amanufacturer for replacement or repair.

User input module 457 provides for user input methods via one or moreuser interface elements for allowing a user or operator to alter voltageproperties or other properties of gaming system 401. User input module457 can communicate through user interface elements of gaming system410, or provide specialized APIs for receiving user input from userinput devices, graphical user interfaces, or via network-based userinterfaces. In some examples, voltages can be lowered according to userinstructions or user control. A user-controllable setting can beestablished by gaming system 410 to allow a user to reduce systemvoltages to levels below manufacturer specified levels. However, thewatchdog and failsafe features herein can be employed to prevent asystem from becoming inoperable during such user voltage adjustments. Inyet further examples, power savings might be more important thanreliability or stability of a system, and margins might be excluded togain additional power savings. Failures during the functional testingmight be ignored if of a certain non-fatal nature (i.e. graphicrendering errors) to allow for even lower voltage operation. Varyingguardbands might be selectable by a user to allow the user control overhow much power savings vs. system stability is desired. Reliability andpower savings improve with lower operating voltages, but stability canbe affected if too low of operating voltages are selected. For example,a first guardband can provide low-power consumption [i.e. 75 mVguardband], a second guardband can provide even lower power consumption[i.e. 50 mV guardband], and a third guardband can provide ultralow-powerconsumption [i.e. 25 mV guardband]. Other levels and guardbands can beselected.

FIG. 4 illustrates voltage adjustment techniques in existing systemswhere either through self-contained firmware code or through onlineupdates, processor voltage levels are reduced incrementally until a safeoperating floor is reached. This methodology accomplishes the powerreduction in a user environment without the utilization of manufacturingsystem test equipment and platforms. Instead of (or in addition to)lowering the operating voltages for a processor device, the example inFIG. 4 utilizes the voltage lowering techniques in a consumerenvironment by running one or more scripts that perform a Vmin search oneach of the power/voltage domains where a reduction is desired. Thescripts might be run responsive to each boot of gaming system 410, ormight instead be scheduled or periodically executed to reduce delays inboot times.

The control for lowering the voltages and reducing power consumption,however, might be executed after manufacture and delivery of gamingsystem 410, and thus improvements to component sizes, such as fans,enclosures, heat sinks, and the like, might not be realized. Regardless,user systems in this case do realize power savings and improvedreliability characteristics after operating at lower voltage levels,lower power levels, and likely cooler temperatures. Also, the usersystems are likely to have improved acoustic characteristics as thesystem operates below the cooling capability inherent in the design.Other advantages include reducing a power footprint of server farms orlarge computing centers where many computing systems are deployed. Thepower consumption savings gained by reducing operational voltages ofprocessing devices below manufacturer specified levels can lead toreduced data center power demands and cooling requirements. However,since the voltage adjustment process might occur in a user siteenvironment where the ambient temperature might not be controlled (incontrast to a manufacturing environment), user site temperature may havean impact on the power savings that can be realized. Some devices haveworse performance at maximum temperature while others may be limited atminimum temperature (i.e. temperature inversion characteristics indevices operating at lower voltages). Although an environmental andenclosure temperature might be able to be known in the user environment,there are limits on being able to control it as is done in amanufacturing environment.

Turning now to FIG. 6, several examples are provided for operation ofcomputer systems and associated processing devices to allow forthermal-based adjustment of voltage. Although the examples in FIG. 6illustrate thermal or temperature-based voltage adjustments, similarprinciples can be applied for power consumption-based voltageadjustments. Other factors can be used to adjust voltage as well, suchas standby mode status or cooling system status. The operations of FIG.6 can be performed by any of the processing devices discussed herein,such as by thermal voltage adjustment module 453 executed by processingdevice 412.

Table 610 includes three thermal regimes 611-613 in which a computingsystem can operate. A first regime 611 is defined where powerconsumption is less than or equal to a preferred power threshold or asystem temperature is less than or equal to a first thresholdtemperature. The temperature can be measured for the entire system, suchas for temperature inside of an associated enclosure, or might insteadbe measured for a specific integrated circuit, such as for a silicon dietemperature of a processing device. In this first regime 611, thecomputing system is operating below desired operating limits and mightbe operating at manufacturer specified voltages or at voltage levelswith associated thermal adjustment margins applied above a Vmin. Also,any associated fans or cooling system elements are operating at optimallevels.

If the temperature increases, a second regime 612 might be entered. Thetemperature might increase due to ambient temperature increases,increased workloads or power dissipations of elements of the associatedcomputing system, or due to other factors. The second regime 612 isdefined where power consumption is greater than a preferred powerthreshold or a system temperature is greater than the first thresholdtemperature. In this second regime 612, the computing system isapproaching desired operating limits and might still be operating atmanufacturer specified voltages (or at a voltage level with associatedthermal voltage lowering margins applied to a minimum operatingvoltage). Also, any associated fans or cooling system elements areoperating at increased levels as compared to the first regime.

If the temperature continues to increases, a third regime 613 might beentered. The temperature might increase even further due to ambienttemperature increases, increased workloads or power dissipations ofelements of the associated computing system, or due to other factors.The third regime 613 is defined where power consumption is greater thana preferred power threshold or a system temperature is greater than asecond threshold temperature which is higher than the first temperaturethreshold. In this second regime 612, the computing system is abovedesired operating limits and voltage levels for a processing device arescaled back to lower levels. These lower voltage levels might correspondto the reduced voltages determined previously or begin to reduceassociated thermal voltage lowering margins. Also, any associated fansor cooling system elements might be operating at maximum levels ascompared to the first and second regimes.

It should be noted that through all three regimes of table 610, nooperational performance degradations or performance throttling to aprocessing device are employed. Since a voltage margin was included inthe first regime, increases in temperature can be countered by loweringinput voltages to the processing device while leaving any operationalperformance parameters (such as operating frequencies, idling states,active states, workloads, throughputs, bandwidths, or other parameters)unaffected and operating at optimal levels.

To further illustrate thermal-based adjustment of voltage levels, flowdiagram 620 is included. In diagram 620, a processing device operates(621) the computing system at selected voltage levels. These selectedvoltage levels can initially be default values, manufacturer specifiedvoltage levels, or reduced voltage levels with thermal margins applied,among other values. As seen in the further operations of diagram 620,the selected voltage levels can change due to increased temperature.Once a first temperature threshold is exceeded (622), such as found inregime 612, the processing device can adjust (623) cooling systemelements to compensate for the increased temperature. Adjusting thecooling system elements can include adjusting fan speeds, louverpositions, heat sink parameters, climate control system parameters, heatpump settings, or other adjustments, including combinations thereof. Ifa second temperature threshold is exceeded (624), then the processingdevice can lower (626) an operating voltage for the processing device,such as by instructing voltage regulation elements to reduce levels ofvoltages supplied to the processing device. These voltage levels can beincrementally lowered to attempt to alleviate temperatures increases insteps. In the operations above, when a voltage level is decreased tocompensate for increased temperature, performance of the processingdevice is maintained and not throttled. However, if a voltage minimumlimit is reached (625) then the voltages might not be able to be loweredfurther to compensate for temperature increases. Responsive to thevoltage minimum limit being reached, the processing device can decreaseor throttle (627) system performance to alter a clock speed, idleportions of the processing device, power down various contextualelements of the computer system, or even power down the entire system inextreme cases. It should be noted that, unlike in operation 627, thevoltage adjustment techniques of operation 626 do not degrade orthrottle performance of the processing device. After a period of timewhen a temperature or power consumption level has decreased, thenoperating voltages and other adjustments for the processing device canbe returned incrementally or returned back to an initial or defaultlevel.

In further examples, techniques for increasing the operational frequencyof systems is provided. For example, frequency maximization module 455provides for enhanced performance of gaming system 410. In these furtherexamples, voltage margins are employed to increase system performanceinstead of lowering system power consumption. Increases in performanceby increasing a clock frequency also can cause increases in powerconsumed at a fixed voltage. However, voltage can be lowered whileincreasing frequency at the same time if a power consumption cap orlimit is desired. In this situation, Vmins can still be found at theoriginal system frequency, as discussed herein. However, a relationshipbetween voltage and frequency (approximately 1% in voltage for every1.5% in frequency) and the nature of how both voltage and frequencyaffect power consumption (leakage and AC power together followapproximately a “voltage cubed times frequency” formula) can allow thevoltage margin to be turned into extra performance at a constant powertarget. In this situation, if computing systems can tolerate differentperformance values, each system can be adjusted independently for thesedifferent performance values, similar to reductions for voltage levels.Although these performance increases can be applied to devices during amanufacturing process, these performance increases can also be achievedin-situ using firmware deployed to a user site.

For this particular example, the operating minimum voltages found withthe procedures noted above are employed dynamically to extract extraperformance from a system without increasing power consumption levels.This extra performance can be achieved by increasing a clock frequencyassociated with a particular voltage or voltage domain. Since maximumpower in many examples is focused on system thermal characteristics,thermal response time of a system is such that a voltage can be adjustedwithout adversely impacting the maximum power being consumed from athermal perspective. Voltage adaptation is accomplished via monitoringeither processing device activity levels through on-device performancemonitors or monitoring associated voltage regulator currents, voltages,or power levels. Depending upon voltage differences between theoperational minimum values (with appropriate guardband) and the voltagelevel specified by a manufacturer, then voltage transitions between highactivity levels and low activity levels can utilize intermediate voltagelevels such that the voltage transition between low and high activity isnot too large. Voltage swings of over 100 mV may be considered excessiveand either have to be compensated for by stepping the voltage inincrements or simply using a fixed amount of additional voltage for lowactivity states, such as a minimum voltage plus 25 mV or a minimumvoltage plus 50 mV.

Thus, the techniques discussed for increasing the operational frequencyand associated device performance allow the system to operate at initialor default voltage levels during periods of time where extra performanceis not desired or needed. Once a higher level of activity is desired, afrequency can be increased and a corresponding voltage can be lowered tokeep power consumption (such as a power consumption level in Watts)below a preferred level. Once a lower desired power level and/or lowactivity level is detected, then the corresponding voltage and frequencylevels can be allowed to recover to a previous value.

FIG. 7 illustrates computing system 700 that is representative of anysystem or collection of systems in which the various operationalarchitectures, platforms, scenarios, and processes disclosed herein maybe implemented. For example, computing system 700 can be used toimplement any of user system 110 in FIG. 1 or gaming system 410 in FIG.4.

Examples of user system 110 or gaming system 410 when implemented bycomputing system 700 include, but are not limited to, a gaming console,smartphone, tablet computer, laptop, server, personal communicationdevice, personal assistance device, wireless communication device,subscriber equipment, customer equipment, access terminal, telephone,mobile wireless telephone, personal digital assistant, personalcomputer, e-book, mobile Internet appliance, wireless network interfacecard, media player, or some other computing apparatus, includingcombinations thereof.

Computing system 700 may be implemented as a single apparatus, system,or device or may be implemented in a distributed manner as multipleapparatuses, systems, or devices. Computing system 700 includes, but isnot limited to, enclosure 701, system on a chip (SoC) device 710, southbridge 730, storage system 731, video elements 732, memory elements 733,network module 734, auxiliary memory 735, voltage regulators 740, inputpower conditioning circuitry 750, cooling elements 752, SoC thermalelements 753, and thermal monitor 754. SoC device 710 is operativelycoupled with the other elements in computing system 700, such as southbridge 730, storage system 731, video elements 732, memory elements 733,network module 734, auxiliary memory 735, voltage regulators 740, SoCthermal elements 753, and thermal monitor 754. One or more of theelements of computing system 700 can be included on motherboard 702,although other arrangements are possible.

SoC device 710 loads and executes software from storage system 731.Software can include various operating systems, user applications,gaming applications, multimedia applications, or other userapplications. Software can also include firmware 760 which includesfurther elements indicated by secure boot firmware 761 and voltagealtering firmware 762. Other software and firmware elements can beincluded in the software stored by storage system 731 and executed bySoC device 710, such as found in FIGS. 1 and 4.

When executed by SoC device 710 to provide voltage adjustment services,thermal voltage adjustment, in-situ characterization, or secure voltagescaling features, the software directs SoC device 710 to operate asdescribed herein for at least the various processes, operationalscenarios, and sequences discussed in the foregoing implementations. SoCdevice 710 may optionally include additional devices, features, orfunctionality not discussed for purposes of brevity.

Referring still to FIG. 7, SoC device 710 may comprise a micro-processorand processing circuitry that retrieves and executes software fromstorage system 731. SoC device 710 may be implemented within a singleprocessing device, but may also be distributed across multipleprocessing devices or sub-systems that cooperate in executing programinstructions. Examples of SoC device 710 include general purpose centralprocessing units, application specific processors, graphics processingunits, and logic devices, as well as any other type of processingdevice, combinations, or variations thereof.

In FIG. 7, SoC device 710 includes processing cores 711, graphics cores712, communication interfaces 713, memory interfaces 714, securityprocessor 720, electronic fuses 721, secure memory 722, among otherelements. Some of the elements of SoC device 710 can be included in anorth bridge portion of SoC device 710.

Storage system 731 may comprise any computer readable storage mediareadable by SoC device 710 and capable of storing software, such asfirmware 760. Storage system 731 may include volatile and nonvolatile,removable and non-removable media implemented in any method ortechnology for storage of information, such as computer readableinstructions, data structures, program modules, or other data. Examplesof storage media include random access memory, read only memory,magnetic disks, optical disks, flash memory, virtual memory andnon-virtual memory, magnetic cassettes, magnetic tape, magnetic diskstorage or other magnetic storage devices, or any other suitable storagemedia. In no case is the computer readable storage media a propagatedsignal. In addition to computer readable storage media, in someimplementations storage system 731 may also include computer readablecommunication media over which at least some of software may becommunicated internally or externally. Storage system 731 may beimplemented as a single storage device, but may also be implementedacross multiple storage devices or sub-systems co-located or distributedrelative to each other. Storage system 731 may comprise additionalelements, such as a controller, capable of communicating with SoC device710 or possibly other systems.

In particular, the program instructions may include various componentsor modules that cooperate or otherwise interact to carry out the variousprocesses and operational scenarios described herein. The variouscomponents or modules may be embodied in compiled or interpretedinstructions, or in some other variation or combination of instructions.The various components or modules may be executed in a synchronous orasynchronous manner, serially or in parallel, in a single threadedenvironment or multi-threaded, or in accordance with any other suitableexecution paradigm, variation, or combination thereof. Software mayinclude additional processes, programs, or components, such as operatingsystem software or other application software, in addition to or thatinclude firmware 760.

In general, software may, when loaded into SoC device 710 and executed,transform a suitable apparatus, system, or device (of which computingsystem 700 is representative) overall from a general-purpose computingsystem into a special-purpose computing system customized to providevoltage adjustment services, thermal voltage adjustment, in-situcharacterization, or secure voltage scaling features, among otherassistance services. Indeed, encoding software on storage system 731 maytransform the physical structure of storage system 731. The specifictransformation of the physical structure may depend on various factorsin different implementations of this description. Examples of suchfactors may include, but are not limited to, the technology used toimplement the storage media of storage system 731 and whether thecomputer-storage media are characterized as primary or secondarystorage, as well as other factors. For example, if the computer readablestorage media are implemented as semiconductor-based memory, softwaremay transform the physical state of the semiconductor memory when theprogram instructions are encoded therein, such as by transforming thestate of transistors, capacitors, or other discrete circuit elementsconstituting the semiconductor memory. A similar transformation mayoccur with respect to magnetic or optical media. Other transformationsof physical media are possible without departing from the scope of thepresent description, with the foregoing examples provided only tofacilitate the present discussion.

Turning now to the other elements of computing system 700, voltageregulators 740 provide operating voltages at associated currents to SoCdevice 710. Voltage regulators 740 comprise various power electronics,power controllers, filters, passive components, and other elements toconvert input power received through input power conditioning elements750 over link 751 from a power source into voltages usable by SoC device710. SoC device 710 can instruct voltage regulators 740 to provideparticular voltage levels for one or more voltage domains, such asfirst, second, and third voltage domains 741-743 in FIG. 7. SoC device710 can instruct voltage regulators 740 to provide particular voltagelevels for one or more operational modes, such as normal, standby, idle,and other modes. Voltage regulators 740 can comprise switched-modevoltage circuitry or other regulation circuitry. Cooling elements 752can include fans, heatsinks, heat pumps, refrigeration elements, solidstate cooling devices, liquid cooling devices, or other cooling elementswhich reduce or maintain a temperature within enclosure 701. SoC thermalelements 753 can include similar elements as cooling elements 752,although applied to SoC device 710 instead of the entire enclosure 701.Thermal monitor 754 can include one or more thermocouples or othertemperature sensing elements which indicate to SoC device 710 a currenttemperature inside of enclosure 701, outside of enclosure 701, ortemperatures associated with the various elements of system 700,including that of SoC device 710.

South bridge 730 includes interfacing and communication elements whichcan provide for coupling of SoC 710 to peripherals, user input devices,user interface devices, printers, microphones, speakers, or otherexternal devices and elements. In some examples, south bridge 730includes a system management bus (SMB) controller or other systemmanagement controller elements. Video elements 732 comprise varioushardware and software elements for outputting digital images, videodata, audio data, or other graphical and multimedia data which can beused to render images on a display, touchscreen, or other outputdevices. Digital conversion equipment, filtering circuitry, image oraudio processing elements, or other equipment can be included in videoelements 732.

Network elements 734 can provide communication between computing system700 and other computing systems (not shown), which may occur over acommunication network or networks and in accordance with variouscommunication protocols, combinations of protocols, or variationsthereof. Example networks include intranets, internets, the Internet,local area networks, wide area networks, wireless networks, wirednetworks, virtual networks, software defined networks, data centerbuses, computing backplanes, or any other type of network, combinationof network, or variation thereof. The aforementioned communicationnetworks and protocols are well known and need not be discussed atlength here. However, some communication protocols that may be usedinclude, but are not limited to, the Internet protocol (IP, IPv4, IPv6,etc.), the transmission control protocol (TCP), and the user datagramprotocol (UDP), as well as any other suitable communication protocol,variation, or combination thereof.

Memory elements 733 can comprise random-access memory (RAM), cachememory devices, or other volatile memory elements employed by SoC 710.Storage system 731 comprises non-volatile memory elements, such as harddisk drives (HDDs), flash memory devices, solid state drives (SSDs),optical storage devices, phase-change memory devices, resistive memorydevices, or other memory devices which store operating systems,applications, voltage adjustment firmware, or other software or firmwarefor system 700. Auxiliary memory 735 can comprise non-volatile memoryelements, such as hard disk drives (HDDs), flash memory devices, solidstate drives (SSDs), optical storage devices, phase-change memorydevices, resistive memory devices, or other memory devices. In someexamples, auxiliary memory 735 is included in storage system 731. Infurther examples, auxiliary memory 735 comprises a secure storagecapable memory device, which can accept digitally signed data, such asvoltage tables, voltage offset data, or other information.

To illustrate operation of some of the elements of FIG. 7, a flowdiagram in FIG. 8 is presented. Specifically, diagram 800 includesoperations which describe secure voltage scaling, such as to bootcomputing system 700 with any of the voltages determined via a voltageadjustment process. In many computer systems, input voltages havesecurity restrictions to prevent unauthorized operators from alteringsystem voltages. Moreover, security measures, such as digitally signedvoltage data can ensure that alterations to stored voltage data cannotoccur without detection. It should be noted that the voltages/levelsindicated in FIG. 8 are merely exemplary, and different voltages/levelswill typically be employed in actual implementations.

Although the operations of FIG. 8 can be executed in general bycomputing system 700, specific operations are directed in FIG. 8 tosecurity processor 720. Security processor 720 comprises a processingcore separate from processing cores 711 and graphics cores 712. Securityprocessor 720 might be included in separate logic than SoC 710 in someexamples. Security processor 720 typically handles initializationprocedures for SoC 710 during a power-on process or boot process. Thus,security processor 720 might be initialized and ready for operationsprior to other elements of SoC 710.

Turning now to the operations of FIG. 8, SoC 710 powers on according toVID-indicated voltages (801). These VID-indicated voltages arerepresented by VIDs 723 in FIG. 7, and can be considered ‘default’voltages that are typically specified according to a manufacturerspecification or hard-coded by a manufacturer using electronic fuses(e-fuses) 721. In some examples, once these VIDs are set by amanufacturer, they cannot be altered by an operator or user of the SoC.The VIDs typically comprise a normalized value or encoded bits which areused to derive an actual voltage for driving SoC 710. Example VIDs canbe seen in table 810 of FIG. 8. Specifically, table 810 includes alisting of voltage domains with corresponding VIDs in hexadecimalnotation, along with a corresponding voltage. In typical examples, onlythe VIDs are provided to voltage regulators 740, and voltage regulators740 translate the VIDs into actual voltages. Table 810 is shown withadditional detail for clarity.

Once at least security processor 720 is powered on after receiving inputpower from voltage regulators 740 according to VIDs 723, then securityprocessor 720 reads (802) voltage offsets 763 from auxiliary memory 735.These voltage offsets are determined in a voltage adjustment process,such as those described above, and stored in auxiliary memory 735 forlater usage. Example voltage offsets are shown in table 811 in FIG. 8,and indicate an incremental offset for a plurality of voltage or powerdomains, which can include positive or negative offsets. The voltageoffsets might be stored in auxiliary memory 735 using a secure storageprocess, such as a digitally signed security process. The securityprocess authenticates the voltage offsets and ensures that tampering oralteration was not performed. The security process can includepublic-private key encryption techniques or other digitalsignature/authentication or data encryption techniques.

The voltage values determined from the voltage adjustment process can bestored into a memory device or data structure along with othercorresponding information, such as time/date of the functional tests,version information for the functional tests, or other information. Theversion identifier can be used to provide special handling of resultsdetermined by different revisions of system 700. This data structure canbe securely signed by a hardware security module (HSM) to ensure thatthe stored voltage information and related information is authentic. Adigital signature for the data structure can be validated during eachsubsequent boot of system 700, and used as the selected operationalvoltage for the remainder of any factory/manufacturing tests andsubsequent user site operation.

Security processor 720 generates (803) a voltage settings table 724 insecure memory 722 using VIDs 723 and voltage offsets 763. In someexamples, security processor 720 adds voltages that correspond to theVIDs to the voltage offsets and generates new VIDs which are stored insecure memory 722. These new VIDs can be presented to voltage regulators740 which responsively implement (804) input voltages for SoC 710 thatcorrespond to the VIDs. Various margins or adjustments to the new VIDsor other voltage information in voltage table 724 can be made duringoperation of SoC 710, such as to add additional margins, implement EoLmargins, provide thermal/power-based voltage adjustment orfrequency-based throttling, or other features. In typical examples, onlysecurity processor 720 can access secure memory 722, and processingcores 711 or graphics cores 712 cannot access secure memory 722. Thus, auser-level application run in an operating system cannot typicallydirectly modify VIDs. However, in this example, security processor 720can receive requests from various drivers, hypervisors, or otherelements to change VIDs responsive to user commands or other alterationinputs.

Certain inventive aspects may be appreciated from the foregoingdisclosure, of which the following are various examples.

Example 1: A method of determining operating voltages for a processingdevice, the method comprising, in a computing assembly comprising theprocessing device, executing a voltage adjustment process to determineat least one input voltage for the processing device lower than amanufacturer specified operating voltage. During the voltage adjustmentprocess, the method includes applying incrementally adjusted inputvoltages to the processing device, operating the processing deviceaccording to a functional test that exercises the processing device incontext with associated system elements of the computing assembly, andmonitoring for operational failures of at least the processing deviceduring application of each of the incrementally adjusted input voltages.Responsive to the operational failures during the functional test, themethod includes determining corresponding values of the incrementallyadjusted input voltages and establishing the at least one input voltagebased at least in part on the corresponding values of the incrementallyadjusted input voltages.

Example 2: The method of Example 1, further comprising, executing thevoltage adjustment process for a processing device while the processingdevice is installed in the computing assembly, where the computingassembly includes one or more of an enclosure, thermal managementelements, memory elements, data storage elements, and power electronicselements exercised during the functional test of the processing device.

Example 3: The method of Examples 1-2, further comprising, incrementallyadjusting the at least one input voltage by initially operating theprocessing device at a first input voltage and progressively loweringthe input voltage in predetermined increments while performing thefunctional test and monitoring for occurrence of the operationalfailures.

Example 4: The method of Examples 1-3, further comprising, incrementallyadjusting the at least one input voltage by initially operating theprocessing device at a first input voltage and progressively raising theinput voltage in predetermined increments while performing thefunctional test and determining a present input voltage at which theoperational failures cease.

Example 5: The method of Examples 1-4, where the functional testcomprises one or more application level processes executed by theprocessing device and configured to exercise processor core elements,graphics core elements, and input/output elements of the processingdevice.

Example 6: The method of Examples 1-5, where executing the voltageadjustment process for the processing device comprises, for each of theincrementally adjusted input voltages, booting the processing deviceinto an operating system and running one or more applications comprisingthe functional test.

Example 7: The method of Examples 1-6, further comprising operating theprocessing device according to the functional test by at least runningthe functional test for a predetermined time period at each of theincrementally adjusted input voltages and monitoring for the operationalfailures during the predetermined time period. When none of theoperational failures are detected during the predetermined time periodfor an associated input voltage, the method includes incrementallyadjusting the at least one input voltage for further operationaltesting.

Example 8: The method of Examples 1-7, further comprising, in adeployment platform, deploying the functional test to the computingassembly over a communication interface of the computing assembly, andin the deployment platform, initiating the functional test andmonitoring for the operational failures.

Example 9: The method of Examples 1-8, where executing the voltageadjustment process comprises determining reduced operating voltages fora plurality of voltage domains of the processing device, with two ormore of the voltage domains active during the functional test, and whereones of the voltage domains correspond to processor core elements,graphics core elements, and input/output elements of the processingdevice.

Example 10: An apparatus comprising one or more computer readablestorage media and program instructions stored on the one or morecomputer readable storage media. Based at least in part on execution bya computing system, the program instructions direct the computing systemto at least execute a voltage adjustment process for a processing deviceincluded in the computing system to determine at least one input voltagefor the processing device lower than a manufacturer specified operatingvoltage. During the voltage adjustment process, the program instructionsdirect the computing system to apply incrementally adjusted inputvoltages to the processing device, operate the processing deviceaccording to a functional test that exercises the processing device incontext with associated system elements of the computing assembly, andmonitor for operational failures of at least the processing deviceduring application of each of the incrementally adjusted input voltages.Responsive to the operational failures during the functional test, theprogram instructions direct the computing system to determinecorresponding values of the incrementally adjusted input voltages andestablish the at least one input voltage based at least in part on thecorresponding values of the incrementally adjusted input voltages.

Example 11: The apparatus of Example 10, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least execute the voltageadjustment process for the processing device while the processing deviceis installed in the computing assembly, where the computing systemincludes one or more of an enclosure, thermal management elements,memory elements, data storage elements, and power electronics elementsexercised during the functional test of the processing device.

Example 12: The apparatus of Examples 10-11, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least incrementally adjust theat least one input voltage by initially operating the processing deviceat a first input voltage and progressively lowering the input voltage inpredetermined increments while performing the functional test andmonitoring for occurrence of the operational failures.

Example 13: The apparatus of Examples 10-12, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least incrementally adjust theat least one input voltage by initially operating the processing deviceat a first input voltage and progressively raising the input voltage inpredetermined increments while performing the functional test anddetermining a present input voltage at which the operational failurescease.

Example 14: The apparatus of Examples 10-13, where the functional testcomprises one or more application level processes executed by theprocessing device and configured to exercise processor core elements,graphics core elements, and input/output elements of the processingdevice.

Example 15: The apparatus of Examples 10-14, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least, for each of theincrementally adjusted input voltages, boot the processing device intoan operating system and run one or more applications comprising thefunctional test.

Example 16: The apparatus of Examples 10-15, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least operate the processingdevice according to the functional test by at least running thefunctional test for a predetermined time period at each of theincrementally adjusted input voltages and monitoring for the operationalfailures during the predetermined time period. When none of theoperational failures are detected during the predetermined time periodfor an associated input voltage, the program instructions direct thecomputing system to incrementally adjust the at least one input voltagefor further operational testing.

Example 17: The apparatus of Examples 10-16, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least receive the functionaltest from a deployment platform into the computing system over acommunication interface of the computing system, and initiate thefunctional test and monitoring for the operational failures responsiveto instructions received from the deployment platform.

Example 18: The apparatus of Examples 10-17, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least determine reducedoperating voltages for a plurality of voltage domains of the processingdevice, with two or more of the voltage domains active during thefunctional test, and where ones of the voltage domains correspond toprocessor core elements, graphics core elements, and input/outputelements of the processing device.

Example 19: A manufacturing test environment for a computing apparatus,comprising a deployment platform configured to deploy and initiate avoltage test process to a computing apparatus over a communication link,the voltage test process configured to determine at least one operatingvoltage for a processing device of the computing apparatus lower than amanufacturer specified operating voltage. Responsive to a command toinitiate the voltage test process received over the communication link,the computing apparatus is configured to apply incrementally adjustedinput voltages to the processing device, operate the processing deviceaccording to a functional test that exercises the processing device incontext with associated system elements of the computing apparatus, andmonitor for operational failures of at least the processing deviceduring application of each of the incrementally adjusted input voltages.Responsive to the operational failures during the functional test, thecomputing apparatus is configured to provide an indication of theoperational failures to the deployment platform and responsivelyreceive, over the communication link, an indication of at least oneinput voltage determined based at least in part on the correspondingvalues of the incrementally adjusted input voltages applied during theoperational failures.

Example 20: The manufacturing test environment of Example 19, comprisingthe computing apparatus configured to operate the processing deviceaccording to the functional test while the processing device isinstalled in the computing apparatus, where the computing apparatusincludes one or more of an enclosure, thermal management elements,memory elements, data storage elements, and power electronics elementsexercised during the functional test of the processing device.

The functional block diagrams, operational scenarios and sequences, andflow diagrams provided in the Figures are representative of exemplarysystems, environments, and methodologies for performing novel aspects ofthe disclosure. While, for purposes of simplicity of explanation,methods included herein may be in the form of a functional diagram,operational scenario or sequence, or flow diagram, and may be describedas a series of acts, it is to be understood and appreciated that themethods are not limited by the order of acts, as some acts may, inaccordance therewith, occur in a different order and/or concurrentlywith other acts from that shown and described herein. For example, thoseskilled in the art will understand and appreciate that a method couldalternatively be represented as a series of interrelated states orevents, such as in a state diagram. Moreover, not all acts illustratedin a methodology may be required for a novel implementation.

The descriptions and figures included herein depict specificimplementations to teach those skilled in the art how to make and usethe best option. For the purpose of teaching inventive principles, someconventional aspects have been simplified or omitted. Those skilled inthe art will appreciate variations from these implementations that fallwithin the scope of the invention. Those skilled in the art will alsoappreciate that the features described above can be combined in variousways to form multiple implementations. As a result, the invention is notlimited to the specific implementations described above, but only by theclaims and their equivalents.

What is claimed is:
 1. A method of determining operating voltages for aprocessing device, the method comprising: in a computing assemblycomprising the processing device, executing a voltage adjustment processto determine at least one input voltage for the processing device lowerthan a manufacturer specified operating voltage; during the voltageadjustment process, applying incrementally adjusted input voltages tothe processing device, operating the processing device according to afunctional test that exercises the processing device in context withassociated system elements of the computing assembly, and monitoring foroperational failures of at least the processing device duringapplication of each of the incrementally adjusted input voltages;responsive to the operational failures during the functional test,determining corresponding values of the incrementally adjusted inputvoltages and establishing the at least one input voltage based at leastin part on the corresponding values of the incrementally adjusted inputvoltages.
 2. The method of claim 1, further comprising: executing thevoltage adjustment process for a processing device while the processingdevice is installed in the computing assembly, wherein the computingassembly includes one or more of an enclosure, thermal managementelements, memory elements, data storage elements, and power electronicselements exercised during the functional test of the processing device.3. The method of claim 1, further comprising: incrementally adjustingthe at least one input voltage by initially operating the processingdevice at a first input voltage and progressively lowering the inputvoltage in predetermined increments while performing the functional testand monitoring for occurrence of the operational failures.
 4. The methodof claim 1, further comprising: incrementally adjusting the at least oneinput voltage by initially operating the processing device at a firstinput voltage and progressively raising the input voltage inpredetermined increments while performing the functional test anddetermining a present input voltage at which the operational failurescease.
 5. The method of claim 1, wherein the functional test comprisesone or more application level processes executed by the processingdevice and configured to exercise processor core elements, graphics coreelements, and input/output elements of the processing device.
 6. Themethod of claim 1, wherein executing the voltage adjustment process forthe processing device comprises, for each of the incrementally adjustedinput voltages, booting the processing device into an operating systemand running one or more applications comprising the functional test. 7.The method of claim 1, further comprising: operating the processingdevice according to the functional test by at least running thefunctional test for a predetermined time period at each of theincrementally adjusted input voltages and monitoring for the operationalfailures during the predetermined time period; and when none of theoperational failures are detected during the predetermined time periodfor an associated input voltage, incrementally adjusting the at leastone input voltage for further operational testing.
 8. The method ofclaim 1, further comprising: in a deployment platform, deploying thefunctional test to the computing assembly over a communication interfaceof the computing assembly; and in the deployment platform, initiatingthe functional test and monitoring for the operational failures.
 9. Themethod of claim 1, wherein executing the voltage adjustment processcomprises determining reduced operating voltages for a plurality ofvoltage domains of the processing device, with two or more of thevoltage domains active during the functional test, and wherein ones ofthe voltage domains correspond to processor core elements, graphics coreelements, and input/output elements of the processing device.
 10. Anapparatus comprising: one or more computer readable storage media;program instructions stored on the one or more computer readable storagemedia that, based at least in part on execution by a computing system,direct the computing system to at least: execute a voltage adjustmentprocess for a processing device included in the computing system todetermine at least one input voltage for the processing device lowerthan a manufacturer specified operating voltage; during the voltageadjustment process, apply incrementally adjusted input voltages to theprocessing device, operate the processing device according to afunctional test that exercises the processing device in context withassociated system elements of the computing assembly, and monitor foroperational failures of at least the processing device duringapplication of each of the incrementally adjusted input voltages;responsive to the operational failures during the functional test,determine corresponding values of the incrementally adjusted inputvoltages and establish the at least one input voltage based at least inpart on the corresponding values of the incrementally adjusted inputvoltages.
 11. The apparatus of claim 10, comprising further programinstructions, based at least in part on execution by the computingsystem, direct the computing system to at least: execute the voltageadjustment process for the processing device while the processing deviceis installed in the computing assembly, wherein the computing systemincludes one or more of an enclosure, thermal management elements,memory elements, data storage elements, and power electronics elementsexercised during the functional test of the processing device.
 12. Theapparatus of claim 10, comprising further program instructions, based atleast in part on execution by the computing system, direct the computingsystem to at least: incrementally adjust the at least one input voltageby initially operating the processing device at a first input voltageand progressively lowering the input voltage in predetermined incrementswhile performing the functional test and monitoring for occurrence ofthe operational failures.
 13. The apparatus of claim 10, comprisingfurther program instructions, based at least in part on execution by thecomputing system, direct the computing system to at least: incrementallyadjust the at least one input voltage by initially operating theprocessing device at a first input voltage and progressively raising theinput voltage in predetermined increments while performing thefunctional test and determining a present input voltage at which theoperational failures cease.
 14. The apparatus of claim 10, wherein thefunctional test comprises one or more application level processesexecuted by the processing device and configured to exercise processorcore elements, graphics core elements, and input/output elements of theprocessing device.
 15. The apparatus of claim 10, comprising furtherprogram instructions, based at least in part on execution by thecomputing system, direct the computing system to at least: for each ofthe incrementally adjusted input voltages, boot the processing deviceinto an operating system and run one or more applications comprising thefunctional test.
 16. The apparatus of claim 10, comprising furtherprogram instructions, based at least in part on execution by thecomputing system, direct the computing system to at least: operate theprocessing device according to the functional test by at least runningthe functional test for a predetermined time period at each of theincrementally adjusted input voltages and monitoring for the operationalfailures during the predetermined time period; and when none of theoperational failures are detected during the predetermined time periodfor an associated input voltage, incrementally adjust the at least oneinput voltage for further operational testing.
 17. The apparatus ofclaim 10, comprising further program instructions, based at least inpart on execution by the computing system, direct the computing systemto at least: receive the functional test from a deployment platform intothe computing system over a communication interface of the computingsystem; and initiate the functional test and monitoring for theoperational failures responsive to instructions received from thedeployment platform.
 18. The apparatus of claim 10, comprising furtherprogram instructions, based at least in part on execution by thecomputing system, direct the computing system to at least: determinereduced operating voltages for a plurality of voltage domains of theprocessing device, with two or more of the voltage domains active duringthe functional test, and wherein ones of the voltage domains correspondto processor core elements, graphics core elements, and input/outputelements of the processing device.
 19. A manufacturing test environmentfor a computing apparatus, comprising: a deployment platform configuredto deploy and initiate a voltage test process to a computing apparatusover a communication link, the voltage test process configured todetermine at least one operating voltage for a processing device of thecomputing apparatus lower than a manufacturer specified operatingvoltage; responsive to a command to initiate the voltage test processreceived over the communication link, the computing apparatus configuredto apply incrementally adjusted input voltages to the processing device,operate the processing device according to a functional test thatexercises the processing device in context with associated systemelements of the computing apparatus, and monitor for operationalfailures of at least the processing device during application of each ofthe incrementally adjusted input voltages; responsive to the operationalfailures during the functional test, the computing apparatus configuredto provide an indication of the operational failures to the deploymentplatform and responsively receive, over the communication link, anindication of at least one input voltage determined based at least inpart on the corresponding values of the incrementally adjusted inputvoltages applied during the operational failures.
 20. The manufacturingtest environment of claim 19, comprising: the computing apparatusconfigured to operate the processing device according to the functionaltest while the processing device is installed in the computingapparatus, wherein the computing apparatus includes one or more of anenclosure, thermal management elements, memory elements, data storageelements, and power electronics elements exercised during the functionaltest of the processing device.